Method for producing alloy films using cold sputter deposition process
US5597458A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 1995 |
| Grant date | Jan 28, 1997 |
| Priority date | — |
| Expiry date | Jul 10, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76838
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for forming an alloy film by cooling a substrate during a sputter deposition process. In one embodiment, aluminum-copper (Al-Cu) alloy film is deposited on a substrate while the substrate is maintained at a temperature lower than 100.degree. C. during a sputter deposition process, thereby reducing the precipitation of CuAl.sub.2. The substrate is cooled by pumping a coolant gas through a cooled platen and against the substrate during processing. Subsequent film formation prior to etching is also performed below 100.degree. C. to prevent precipitation of CuAl.sub.2 until the Al-Cu alloy film is etched. Large crystal grains are formed by annealing the substrate after etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.