Method of making circuitized substrate
US5599747A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 1995 |
| Grant date | Feb 4, 1997 |
| Priority date | — |
| Expiry date | Jun 27, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and partially routing this member to define a temporary support portion therein. Metallization and circuitization may then occur, following which the temporary support portion is removed. This temporary support thus assures effective support for the photoresist used as part of the circuitization process. Thus, the photoresist is capable of being applied in sheetlike form for spanning the relatively small openings of the dielectric without sagging, bowing, etc., which may adversely impact subsequent processing steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.