Thomas P. Duffy
27Patents
14h-index
58Co-inventors
84Inventor score
Filing activity: Aug 9, 1989 → Mar 21, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6563294B2 | System and method for highly phased power regulation | Electricity | 104 | Expired |
| US6965502B2 | System, device and method for providing voltage regulation to a microelectronic device | Physics | 97 | Expired |
| US6795009B2 | System and method for current handling in a digitally-controlled power converter | Electricity | 68 | Expired |
| US5798909A | Single-tiered organic chip carriers for wire bond-type chips | Emerging Cross-Sectional Technologies | 54 | Expired |
| US5876842A | Modular circuit package having vertically aligned power and signal cores | Emerging Cross-Sectional Technologies | 48 | Expired |
| US5578796A | Apparatus for laminating and circuitizing substrates having openings therein | Emerging Cross-Sectional Technologies | 44 | Expired |
| US5620782A | Method of fabricating a flex laminate package | Emerging Cross-Sectional Technologies | 36 | Expired |
| US5724232A | Chip carrier having an organic photopatternable material and a metal substrate | Emerging Cross-Sectional Technologies | 34 | Expired |
| US5384690A | Flex laminate package for a parallel processor | Emerging Cross-Sectional Technologies | 34 | Expired |
| US5599747A | Method of making circuitized substrate | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5460921A | High density pattern template: materials and processes for the application of conductive pastes | Emerging Cross-Sectional Technologies | 21 | Expired |
| US7002249B2 | Microelectronic component with reduced parasitic inductance and method of fabricating | Emerging Cross-Sectional Technologies | 20 | Expired |
| US5566448A | Method of construction for multi-tiered cavities used in laminate carriers | Emerging Cross-Sectional Technologies | 19 | Expired |
| US5055151A | Porous filamentary mats and method of making same | Fixed Constructions | 17 | Expired |
| US5817405A | Circuitized substrate with same surface conductors of different resolutions | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5789121A | High density template: materials and processes for the application of conductive pastes | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5509196A | Method of fabricating a flex laminate package | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6038137A | Chip carrier having a chip mounted on an organic dielectric substrate overlaid with a photoimageable dielectric having circuitry thereon | Emerging Cross-Sectional Technologies | 13 | Expired |
| US5542175A | Method of laminating and circuitizing substrates having openings therein | Emerging Cross-Sectional Technologies | 12 | Expired |
| US5707893A | Method of making a circuitized substrate using two different metallization processes | Emerging Cross-Sectional Technologies | 12 | Expired |
| US5395198A | Vacuum loading chuck and fixture for flexible printed circuit panels | Electricity | 9 | Expired |
| US6674320B2 | System and method for orthogonal inductance variation | Electricity | 7 | Expired |
| US9325194B2 | Method of forming a power supply controller and structure therefor | Emerging Cross-Sectional Technologies | 1 | Active |
| US8300374B2 | Method for limiting current and circuit therefor | Electricity | 0 | Active |
| US11949406B2 | Gate driver with thermal monitoring and current sensing | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.