Method for depositing a titanium or tantalum nitride or nitride silicide
US5603988A · kind A · utility
7Cited by
2References
22Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 2, 1995 |
| Grant date | Feb 18, 1997 |
| Priority date | — |
| Expiry date | Jun 2, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/34
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Titanium and/or tantalum nitrides or nitride silicides are deposited onto a substrate by chemical vapor deposition of a titanium and/or tantalum silylamido complex.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.