Hot vacuum device removal process and apparatus
US5605277A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 1994 |
| Grant date | Feb 25, 1997 |
| Priority date | — |
| Expiry date | Dec 20, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A cost efficient, highly reliable method to remove electronic devices and components from substrates eliminates separate tooling for every substrate and device or component size. The apparatus which implements the method allows for multiple device or component removal simultaneously, or in a single sequential operation, in a nondestructive action in a very low cost environment. A box oven and vacuum system and is used with different device or component and substrate sizes providing a simple, low cost, molten device removal procedure, eliminating the need for thermal monitor build and associated profiling for each product. The apparatus works independently of chip type or size, utilizing universal fixturing, and can be set up to pull multiple devices and/or components in a single run.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.