William E. Sablinski
25Patents
14h-index
55Co-inventors
80Inventor score
Filing activity: Oct 31, 1990 → Jan 2, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6740959B2 | EMI shielding for semiconductor chip carriers | Electricity | 65 | Expired |
| US6235996A | Interconnection structure and process module assembly and rework | Emerging Cross-Sectional Technologies | 44 | Expired |
| US6283359A | Method for enhancing fatigue life of ball grid arrays | Emerging Cross-Sectional Technologies | 34 | Expired |
| US5881945A | Multi-layer solder seal band for semiconductor substrates and process | Electricity | 32 | Expired |
| US5881944A | Multi-layer solder seal band for semiconductor substrates | Emerging Cross-Sectional Technologies | 29 | Expired |
| US6158644A | Method for enhancing fatigue life of ball grid arrays | Emerging Cross-Sectional Technologies | 29 | Expired |
| US6429388B1 | High density column grid array connections and method thereof | Emerging Cross-Sectional Technologies | 25 | Expired |
| US5153408A | Method and structure for repairing electrical lines | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6892925B2 | Solder hierarchy for lead free solder joint | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6518674B2 | Temporary attach article and method for temporary attach of devices to a substrate | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6253986A | Solder disc connection | Emerging Cross-Sectional Technologies | 17 | Expired |
| US5868304A | Socketable bump grid array shaped-solder on copper spheres | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6278184A | Solder disc connection | Emerging Cross-Sectional Technologies | 15 | Expired |
| US5605277A | Hot vacuum device removal process and apparatus | Performing Operations; Transporting | 14 | Expired |
| US5543584A | Structure for repairing electrical lines | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6574859B2 | Interconnection process for module assembly and rework | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6070321A | Solder disc connection | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6854636B2 | Structure and method for lead free solder electronic package interconnections | Electricity | 7 | Expired |
| US6995084B2 | Method for forming robust solder interconnect structures by reducing effects of seed layer underetching | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6827505B2 | Optoelectronic package structure and process for planar passive optical and optoelectronic devices | Electricity | 3 | Expired |
| US7473997B2 | Method for forming robust solder interconnect structures by reducing effects of seed layer underetching | Emerging Cross-Sectional Technologies | 2 | Active |
| US6303400A | Temporary attach article and method for temporary attach of devices to a substrate | Emerging Cross-Sectional Technologies | 0 | Expired |
| US6070782A | Socketable bump grid array shaped-solder on copper spheres | Electricity | 0 | Expired |
| US7767575B2 | Forming robust solder interconnect structures by reducing effects of seed layer underetching | Emerging Cross-Sectional Technologies | 0 | Active |
| US7932342B2 | Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend system | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.