System with chip to chip communication
US5621913A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 1994 |
| Grant date | Apr 15, 1997 |
| Priority date | — |
| Expiry date | Nov 15, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L2101/622
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A system for wireless communication between a plurality of semiconductor chips is disclosed. Each data line in the present invention is coupled with a transmitter for transmitting information to any other semiconductor chip. Furthermore, each data line is coupled with a receiver for receiving information transmitted by any transmitter. The system also comprises multiple antennas, fabricated from the chip's metalization layer. Nonetheless, separate antennas within the chip packaging can also be used. The antenna unit comprises a dipole and a loop antenna in a planar arrangement, thereby forming a spherical electromagnetic pattern of coverage and making the orientation between semiconductor chips for transmission purposes substantially irrelevant. Each transmitter in the system comprises a modulator for modulating the information being transmitted, while each receiver comprises a demodulator for demodulating the information transmitted. Several modulation schemes can be employed, though amplitude modulation is preferred, whereby each transmitter has a distinct carrier frequency within the operative radio frequency spectra--preferably above 900 MHz. Each transmitter and receiver is co…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.