Semiconductor wafer contact system and method for contacting a semiconductor wafer
US5629630A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1995 |
| Grant date | May 13, 1997 |
| Priority date | — |
| Expiry date | Feb 27, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2831
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor wafer contact system includes a base substrate (13) which has an array of raised supports (18). The array of raised supports (18) are distributed in a pattern corresponding to the pattern of electrical contacts (12) on the semiconductor wafer (10), to be contacted. In between the base substrate (13) and the wafer to be contacted (10) is a flexible circuit layer (14) including an array of electrical contacts (15) having the same pattern as the contacts (12) of the wafer and the raised supports (18). The raised supports (18) provide focused and localized force, pressing the membrane test contacts (15) against the wafer electrical contacts (12).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.