Microelectronic contacts with asperities and methods of making same
US5632631A · kind A · utility
175Cited by
37References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 1994 |
| Grant date | May 27, 1997 |
| Priority date | — |
| Expiry date | Sep 14, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49224
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.