Polishing endpoint detection method
US5639388A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 1996 |
| Grant date | Jun 17, 1997 |
| Priority date | — |
| Expiry date | Jan 18, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An endpoint detection in a polishing process of a polishing object which has a first layer and a second layer, formed under the first layer, is performed by holding the polishing object on a top ring and pressing a surface of the first layer of the polishing object onto a polishing cloth mounted on a rotating turntable so as to remove the first layer, oscillating the top ring in contact with the turntable, periodically measuring a torque on the rotating turntable when the top ring is positioned at a specific radial location defined by a radius from a rotational center of the turntable, and determining the endpoint based on a change in the torque generated when the first layer is removed and the second layer comes into contact with the polishing cloth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.