Direct imaging process for forming resist pattern on a surface and use thereof in fabricating printing plates
US5641608A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1995 |
| Grant date | Jun 24, 1997 |
| Priority date | — |
| Expiry date | Oct 23, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/165
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A process is described for the direct production of an imaged pattern of resist on a substrate surface (such as a pattern of etch-resistant organic resin material on the surface of a copper-clad dielectric in connection with a printed circuit board (PCB) fabrication process or in the process of producing printed plates), which process utilizes thermo-resists rather than photoresists, i.e., compositions which undergo thermally-induced, rather than photo-induced, chemical transformations. A film of thermo-resist composition applied to the substrate surface is scanned by a focused heat source (e.g., a thermal laser emitting in the IR region) in a predetermined pattern, without a phototool, to bring about localized thermally-induced chemical transformations of the composition which either directly produce the resist pattern or produce in the film a developable latent image of the pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.