Method and apparatus for polishing workpiece
US5651724A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 1995 |
| Grant date | Jul 29, 1997 |
| Priority date | — |
| Expiry date | Sep 7, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A predetermined amount of liquid such as water is supplied to a backside surface of a workpiece such as a semiconductor wafer. Such liquid is a workpiece retaining liquid and is attached to a concave workpiece holding surface of a top ring. The workpiece is positioned between a turntable and the top ring and is polished by an abrasive cloth on the turntable while the workpiece is being pressed against the turntable by the top ring. While polishing, the workpiece is deformed toward the concave workpiece holding surface of the top ring, and a curvature of the deformed workpiece is controlled by the amount of liquid between the workpiece holding surface and the backside surface of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.