Method of forming coating film and apparatus therefor
US5658615A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Mar 25, 1994 |
| Grant date | Aug 19, 1997 |
| Priority date | — |
| Expiry date | Mar 25, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for forming a coating film, comprises a spin chuck for supporting a substrate with one surface facing upward and rotating the substrate about a vertical axis, a first nozzle for supplying a solvent of a coating solution on the substrate, and a second nozzle for supplying the coating solution on a central portion of the substrate. The first and second nozzles are supported by a head such that the supported nozzle moves between a dropping position above the substrate and a waiting position offset from the substrate. The solvent and coating solution are diffused along the surface of the substrate by rotating the spin chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.