Magnetic sensing robotics for automated semiconductor wafer processing systems
US5668452A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 1996 |
| Grant date | Sep 16, 1997 |
| Priority date | — |
| Expiry date | May 9, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/138
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A collision avoidance technique is provided in an automated semiconductor wafer processing system, wherein a magnet or magnetic strip is incorporated into each boat or carrier used to hold and transport the semiconductor wafers during the IC fabrication process. Additionally, a magnetic field sensing device is incorporated into the robotic arm of the system for sensing the presence of magnetic fields generated by the magnet(s) incorporated into the boats and/or carriers. Using this system, it is possible for the automated system controller to determine whether an imminent collision is about to occur by monitoring changes in the detected magnetic field. In this way, collisions between one boat/carrier and a second boat/carrier may be anticipated and avoided without relying upon physical contact between the two objects in order to detect collision.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.