Apparatus and method for polishing workpiece
US5670011A · kind A · utility
33Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 1996 |
| Grant date | Sep 23, 1997 |
| Priority date | — |
| Expiry date | May 2, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A workpiece such as a semiconductor wafer is polished to a flat mirror finish. The workpiece is held by a top ring, and a lower surface of the workpiece is polished by pressing the workpiece against an abrasive cloth mounted on a turntable while applying an abrasive solution onto the abrasive cloth. While the workpiece is being polished, an upper surface of the semiconductor wafer is prevented from being etched by supplying a neutralizer between the upper surface of the semiconductor wafer and the holding surface of the top ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.