Vacuum plasma processing wherein workpiece position is detected prior to chuck being activated
US5670066A · kind A · utility
182Cited by
14References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 1995 |
| Grant date | Sep 23, 1997 |
| Priority date | — |
| Expiry date | Mar 17, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A determination of whether a workpiece is properly positioned on an electrostatic chuck in a vacuum plasma processing chamber is made by measuring the capacitance across a pair of electrodes of the chuck. If the chuck is properly positioned, the workpiece is held in situ on the chuck by applying a DC voltage to the chuck. The workpiece is then processed by the plasma.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.