Multilayered electrostatic chuck and method of manufacture thereof
US5671116A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 10, 1995 |
| Grant date | Sep 23, 1997 |
| Priority date | — |
| Expiry date | Mar 10, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ceramic electrostatic chucking device having electrostatic clamping electrodes suitable for clamping wafers and flat panel displays. The chucking device includes a top insulating layer, the clamping electrode, a second insulating layer, a first metallization layer for distributing power to one of the clamping electrodes, a third insulating layer, a second metallization layer for distributing power to the other clamping electrode, a fourth insulation layer, inner and outer heater electrodes, a fifth insulating layer, a third metallization layer for distributing power to the heater electrodes, and at least one additional insulating layer. The insulating layers include groups of electrically conductive feedthroughs for interconnecting the electrodes and metallization layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.