Method for bonding a heat sink to a die paddle
US5672547A · kind A · utility
6Cited by
11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 1996 |
| Grant date | Sep 30, 1997 |
| Priority date | — |
| Expiry date | Jan 31, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of bonding an integrated circuit die to a heat sink by first providing a lead frame that has a die paddle portion having a top surface, a bottom surface, and at least one aperture therethrough, positioning a heat sink abutting the bottom surface of the die paddle portion, and then pressing an integrated circuit die against the top surface of the die paddle portion with an adhesive material sandwiched therein between such that the adhesive flows through at least one aperture in the die paddle portion to bond the integrated circuit die and the heat sink together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.