Method of forming an electrically conductive polymer bump over an aluminum electrode
US5674780A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 1995 |
| Grant date | Oct 7, 1997 |
| Priority date | — |
| Expiry date | Jul 24, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming an electrically conductive polymer bump (22) over an aluminum electrode (21) produces low contact resistance for an interconnect structure (24). Aluminum oxide is first removed from the aluminum electrode (21). Tiron and palladium are subsequently bonded to the fresh surface of the aluminum electrode (21). Finally, the electrically conductive polymer bump (22) is formed over the aluminum electrode (21). The Tiron and palladium improve the electrical contact between the conductive polymer bump (22) and the aluminum electrode (21) thereby reducing the contact resistance. The Tiron also inhibits corrosion of the aluminum electrode (21) and enhances the conductivity by catalytically shrinking the cyanate ester conductive bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.