Substrate spin treating method and apparatus
US5677000A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 1996 |
| Grant date | Oct 14, 1997 |
| Priority date | — |
| Expiry date | Aug 19, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate spin treating method and apparatus having a cup cleaner device for cleaning a scatter preventive cup, which cleaner device does not require attaching and/or detaching of a cleaning jig. The cleaner device is driven through engagement with a spin chuck which operates at a low torque that is provided for normal substrate spin treating operation. During the normal spin treating operation, only the spin chuck is driven by a rotary shaft, with the cup cleaner device being disengaged from the spin chuck and its driving rotary shaft. For a cup cleaning operation, the spin chuck and scatter preventive cup are vertically moved relative to each other to place the cup cleaner device at a cup cleaning height and to drivingly connect the cup cleaner device to the rotary shaft through a torque transmitter. In this state, the cup cleaner device is rotated to establish a centrifugal force that scatters a cleaning solution supplied to a cleaning solution guide of the cup cleaner device from cleaning solution supply nozzles, thereby cleaning inner surfaces of the scatter preventive cup.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.