Leads between chips assembly
US5677567A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1996 |
| Grant date | Oct 14, 1997 |
| Priority date | — |
| Expiry date | Jun 17, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device and method for increasing integrated circuit density comprising at least a pair of superimposed dice, wherein at least one of the superimposed dice has at least one bond pad variably positioned on an active surface of the die. A plurality of lead fingers from a leadframe extend between the dice. The leadframe comprises at least one lead with leads of non-uniform length and configuration to attach to the differently positioned bond pads of the multiple dice. An advantage of the present invention is that it allows dice with differing bond pad arrangements to be used in a superimposed configuration to increase circuit density, while eliminating the use of bond wires in such a configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.