Method and apparatus for drying a substrate having a resist film with a miniaturized pattern
US5678116A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 1995 |
| Grant date | Oct 14, 1997 |
| Priority date | — |
| Expiry date | Apr 4, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of processing a substrate includes the steps of developing a substrate having a photo-sensitive resin film formed on its surface; washing the substrate by supplying washing liquid to the surface of the substrate, and rotating the substrate on a perpendicular axis in a horizontal plane and thereby drying the surface of the substrate, and atmosphere in which the substrate is placed is adjusted to be at a pressure lower than the atmospheric pressure in the step of drying the surface of the substrate. Instead of or in addition to this, washing liquid in which prescribed gas is dissolved may be used in the step of washing the substrate. In this case, in the step of drying the surface of the substrate, washing liquid supplied to the surface of the substrate is preferably supersaturated with gas. A substrate processing apparatus including a controller for implementing such a method is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.