Semiconductor chip assemblies, methods of making same and components for same
US5679977A · kind A · utility
430Cited by
98References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1993 |
| Grant date | Oct 21, 1997 |
| Priority date | — |
| Expiry date | Apr 28, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensate for thermal expansion. A resilient element such as a compliant layer interposed between the chip and terminals permits independent movement of the individual terminals toward the chip driving engagement with a test probe assembly so as to permit reliable engagement despite tolerances.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.