Spiral grooved polishing pad for chemical-mechanical planarization of semiconductor wafers
US5690540A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1996 |
| Grant date | Nov 25, 1997 |
| Priority date | — |
| Expiry date | Feb 23, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is a polishing pad for use in chemical-mechanical planarization of semiconductor wafers by placing a wafer against a polishing surface of the polishing pad while rotating the polishing pad about its center in the presence of a polishing slurry. The polishing surface has formed therein one or more grooves extending in a spiral inwardly from the periphery to the center of the polishing pad. As a result, slurry is transported inwardly toward the center or toward the periphery of the polishing pad depending upon the circumferential direction of the spiral relative to the direction of rotation of the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.