Michael A. Walker
80Patents
34h-index
20Co-inventors
88Inventor score
Filing activity: Mar 13, 1992 → Mar 9, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5498562A | Semiconductor processing methods of forming stacked capacitors | Electricity | 200 | Expired |
| US5162248A | Optimized container stacked capacitor DRAM cell utilizing sacrificial oxide deposition and chemical mechanical polishing | Electricity | 173 | Expired |
| US5270241A | Optimized container stacked capacitor DRAM cell utilizing sacrificial oxide deposition and chemical mechanical polishing | Electricity | 161 | Expired |
| US5616069A | Directional spray pad scrubber | Performing Operations; Transporting | 127 | Expired |
| US5690540A | Spiral grooved polishing pad for chemical-mechanical planarization of semiconductor wafers | Performing Operations; Transporting | 126 | Expired |
| US5981396A | Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers | Electricity | 117 | Expired |
| US5733176A | Polishing pad and method of use | Emerging Cross-Sectional Technologies | 114 | Expired |
| US5893754A | Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers | Electricity | 112 | Expired |
| US6200901A | Polishing polymer surfaces on non-porous CMP pads | Electricity | 108 | Expired |
| US6261163A | Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies | Performing Operations; Transporting | 108 | Expired |
| US6306014A | Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies | Performing Operations; Transporting | 104 | Expired |
| US6296557A | Method and apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies | Performing Operations; Transporting | 100 | Expired |
| US5919082A | Fixed abrasive polishing pad | Performing Operations; Transporting | 94 | Expired |
| US6273800A | Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates | Performing Operations; Transporting | 93 | Expired |
| US6361417B1 | Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates | Performing Operations; Transporting | 88 | Expired |
| US6090475A | Polishing pad, methods of manufacturing and use | Emerging Cross-Sectional Technologies | 86 | Expired |
| US5855804A | Method and apparatus for stopping mechanical and chemical-mechanical planarization of substrates at desired endpoints | Electricity | 84 | Expired |
| US6331139A | Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates | Performing Operations; Transporting | 81 | Expired |
| US5652164A | Semiconductor processing methods of forming stacked capacitors | Electricity | 80 | Expired |
| US5855811A | Cleaning composition containing tetraalkylammonium salt and use thereof in semiconductor fabrication | Emerging Cross-Sectional Technologies | 77 | Expired |
| US6037218A | Semiconductor processing methods of forming stacked capacitors | Electricity | 77 | Expired |
| US6180450A | Semiconductor processing methods of forming stacked capacitors | Electricity | 76 | Expired |
| US5779522A | Directional spray pad scrubber | Performing Operations; Transporting | 76 | Expired |
| US6206769A | Method and apparatus for stopping mechanical and chemical mechanical planarization of substrates at desired endpoints | Electricity | 69 | Expired |
| US5990012A | Chemical-mechanical polishing of hydrophobic materials by use of incorporated-particle polishing pads | Performing Operations; Transporting | 67 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.