Process for producing multilayer printed circuit board
US5690837A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1995 |
| Grant date | Nov 25, 1997 |
| Priority date | — |
| Expiry date | Dec 21, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0796
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a process for producing a multilayer printed circuit board comprising drilling holes for via holes in a composite film material containing at least a copper foil and an insulating half-cured adhesive layer, laminating the resulting film material on an innerlayer circuit substrate, ad electrically connecting an innerlayer circuit with an outer layer copper foil, when an adhesive resin flowed into the holes is roughened, or when a composite film material having a copper foil of less than 12 .mu.m thick formed on a carrier is used, or a special cushion material is further laminated on the laminate of the innerlayer circuit substrate and the film material, electrical connection reliability is enhanced and circuit density can be increased with easy steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.