Apparatus and method for cooling a substrate
US5697427A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 1995 |
| Grant date | Dec 16, 1997 |
| Priority date | — |
| Expiry date | Dec 22, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and a concomitant method of supporting a substrate while providing effective backside cooling for the substrate. The apparatus comprises a platen having support pins, attached to the platen, for supporting a substrate in a spaced apart relation to the platen. The support pins cause a gap to be formed between the substrate and the platen. The platen contains at least one heat transfer medium supply portal that passes through the platen to supply a heat transfer medium to the gap between the substrate and platen. Lastly, the apparatus contains a flow control assembly, located proximate the peripheral edge of the substrate, for controlling the flow of the heat transfer medium through the gap between the platen and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.