Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers
US5703400A · kind A · utility
163Cited by
11References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 1996 |
| Grant date | Dec 30, 1997 |
| Priority date | — |
| Expiry date | Jul 22, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/928
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
First and second flexible interconnect structures are provided and each includes a flexible interconnect layer and a chip with a surface having chip pads attached to the flexible interconnect layer. Molding material is inserted between the flexible interconnect layers for encapsulating the respective chips. Vias in the flexible interconnect layers are formed to extend to selected chip pads, and a pattern of electrical conductors is applied which extends over the flexible interconnect layers and into the vias to couple selected ones of the chip pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.