Method of making a circuitized substrate using two different metallization processes
US5707893A · kind A · utility
12Cited by
15References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1995 |
| Grant date | Jan 13, 1998 |
| Priority date | — |
| Expiry date | Dec 1, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for making a circuitized substrate is defined wherein the substrate is treated with two different, e.g., additive and subtractive, metallization processes. The process is thus able to effectively produce substrates including conductive features, e.g., high density circuit lines and chip heat-sinking pads, of two different degrees of resolution in a cost effective and expeditious manner. The resulting product is also defined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.