Ball grid array semiconductor package with ring-type heat sink
US5708567A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Nov 13, 1996 |
| Grant date | Jan 13, 1998 |
| Priority date | — |
| Expiry date | Nov 13, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A BGA (ball grid array) semiconductor package with a ring-type heat sink is disclosed. In the above package, the heat dissipating area is enlarged by extending the edge of a chip mounting die paddle formed of a copper or copper alloy layer to the outside of the package. The ring-type heat sink is attached to the extended portion of the die paddle such that the heat sink surrounds the encapsulant of the package. The above BGA package thus directly and effectively dissipates the chip's heat through the heat sink with high thermal conductivity. A plurality of plated through holes may be formed on the chip mounting portion of the PCB of the above package. The BGA package with both the ring-type heat sink and the PTHs, the heat dissipating effect of the package is further improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.