Inventor · Singapore, SG

Il Kwon Shim

211Patents
36h-index
112Co-inventors
93Inventor score

Filing activity: Mar 16, 1994 → May 23, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US6531784B1 Semiconductor package with spacer strips Electricity 202 Expired
US6861288B2 Stacked semiconductor packages and method for the fabrication thereof Electricity 159 Expired
US7838337B2 Semiconductor device and method of forming an interposer package with through silicon vias Electricity 115 Active
US6683377B1 Multi-stacked memory package Electricity 95 Expired
US8039303B2 Method of forming stress relief layer between die and interconnect structure Electricity 84 Active
US5953589A Ball grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the same Electricity 79 Expired
US6462274B1 Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages Electricity 78 Expired
US6599779B2 PBGA substrate for anchoring heat sink Electricity 78 Expired
US5641946A Method and circuit board structure for leveling solder balls in ball grid array semiconductor packages Emerging Cross-Sectional Technologies 76 Expired
US7598606B2 Integrated circuit package system with die and package combination Electricity 71 Active
US8263439B2 Semiconductor device and method of forming an interposer package with through silicon vias Electricity 70 Active
US5635671A Mold runner removal from a substrate-based packaged electronic device Electricity 68 Expired
US6798049B1 Semiconductor package and method for fabricating the same Electricity 66 Expired
US5708567A Ball grid array semiconductor package with ring-type heat sink Electricity 64 Expired
US7399658B2 Pre-molded leadframe and method therefor Electricity 63 Active
US8354304B2 Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant Electricity 63 Active
US6943057B1 Multichip module package and fabrication method Electricity 62 Expired
US8993377B2 Semiconductor device and method of bonding different size semiconductor die at the wafer level Electricity 59 Active
US7372141B2 Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides Electricity 59 Expired
US7005325B2 Semiconductor package with passive device integration Emerging Cross-Sectional Technologies 58 Expired
US7364945B2 Method of mounting an integrated circuit package in an encapsulant cavity Electricity 57 Expired
US6414396B1 Package for stacked integrated circuits Electricity 54 Expired
US7429787B2 Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides Electricity 54 Expired
US5864470A Flexible circuit board for ball grid array semiconductor package Electricity 53 Expired
US7309913B2 Stacked semiconductor packages Electricity 52 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.