Reduced electromigration interconnection line
US5712510A · kind A · utility
49Cited by
12References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 1995 |
| Grant date | Jan 27, 1998 |
| Priority date | — |
| Expiry date | Aug 4, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The electromigration lifetime of a metal interconnection line is increased by adjusting the length of the interconnection line, or providing longitudinally spaced apart holes or vias, to optimize the Backflow Potential Capacity of the metal interconnection line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.