Inventor · San Jose, CA, US

Nguyen Duc Bui

21Patents
10h-index
15Co-inventors
72Inventor score

Filing activity: Dec 1, 1994 → Feb 25, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US6163049A Method of forming a composite interpoly gate dielectric Electricity 84 Expired
US5712510A Reduced electromigration interconnection line Electricity 49 Expired
US6320391A Interconnection device for low and high current stress electromigration and correlation study Physics 36 Expired
US5689139A Enhanced electromigration lifetime of metal interconnection lines Electricity 29 Expired
US5650651A Plasma damage reduction device for sub-half micron technology Electricity 23 Expired
US6472233B1 MOSFET test structure for capacitance-voltage measurements Electricity 20 Expired
US6329831A Method and apparatus for reliability testing of integrated circuit structures and devices Physics 20 Expired
US5726458A Hot carrier injection test structure and technique for statistical evaluation Electricity 14 Expired
US5786705A Method for evaluating the effect of a barrier layer on electromigration for plug and non-plug interconnect systems Physics 13 Expired
US5598009A Hot carrier injection test structure and testing technique for statistical evaluation Electricity 12 Expired
US5966024A Sensitive method of evaluating process induced damage in MOSFETs using a differential amplifier operational principle Electricity 10 Expired
US6700154B1 EEPROM cell with trench coupling capacitor Electricity 9 Expired
US6100101A Sensitive technique for metal-void detection Emerging Cross-Sectional Technologies 7 Expired
US5612627A Method for evaluating the effect of a barrier layer on electromigration for plug and non-plug interconnect systems Physics 5 Expired
US6413820B1 Method of forming a composite interpoly gate dielectric Electricity 5 Expired
US6063662A Methods for forming a control gate apparatus in non-volatile memory semiconductor devices Electricity 5 Expired
US6005409A Detection of process-induced damage on transistors in real time Electricity 5 Expired
US5808361A Intergrated circuit interconnect via structure having low resistance Electricity 4 Expired
US10217521B2 Multi-time programmable non-volatile memory cell Electricity 3 Active
US11295825B2 Multi-time programmable non-volatile memory cell Electricity 1 Active
US6703305B1 Semiconductor device having metallized interconnect structure and method of fabrication Electricity 0 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.