Method and apparatus for determining chamber cleaning end point
US5712702A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 1996 |
| Grant date | Jan 27, 1998 |
| Priority date | — |
| Expiry date | Dec 6, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A marker element is included in a deposition chamber. After use of the chamber to deposit films or coatings on workpieces, the chamber is cleaned to remove materials which may contaminate future processing of workpieces in the chamber. The composition of the gas exhausted from the chamber during the cleaning process is monitored, and a characteristic of the marker element is sensed. The cleaning gas is terminated in response to the sensed characteristic of the marker element having a predetermined value, such as a peak intensity or the return to a baseline value after peaking. The present invention effectively solves the problem of overcleaning or undercleaning the chamber based upon an estimated film thickness build up.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.