Patent · US Expired

Rapid thermal processing high-performance multizone illuminator for wafer backside heating

US5715361A · kind A · utility

53Cited by
9References
19Claims
0Family size

Assignee

Inventor

Key dates

Filing dateApr 13, 1995
Grant dateFeb 3, 1998
Priority date
Expiry dateApr 13, 2015

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C16/52
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A multizone illuminator rapid thermal processing system for fabricating a semiconductor device having a face on which an electronic medium is deposited. The system includes a processing chamber for establishing a semiconductor device fabrication environment for rapid thermal processing, an optically reflective gas injector for injecting a process gas into the semiconductor device fabrication environment, a semiconductor device holding mechanism for holding the semiconductor device in the semiconductor device fabrication environment, and a multizone illuminator positioned in association with the process chamber for illuminating the backside of the semiconductor device to perform a rapid semiconductor thermal process. The system can also include a multipoint temperature sensor system used in conjunction with a multizone variable temperature controller to increase dynamic temperature uniformity and repeatability control.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.