CVC Products, Inc.
46Patents
0Active
46Granted
38Portfolio score
Filing activity: Jul 29, 1992 → Apr 1, 2002
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6692575B1 | Apparatus for supporting a substrate in a reaction chamber | Emerging Cross-Sectional Technologies | 522 | Expired |
| US5937142A | Multi-zone illuminator for rapid thermal processing | Electricity | 400 | Expired |
| US6136165A | Apparatus for inductively-coupled-plasma-enhanced ionized physical-vapor deposition | Electricity | 153 | Expired |
| US6365502B1 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Electricity | 94 | Expired |
| US6294836A | Semiconductor chip interconnect barrier material and fabrication method | Electricity | 92 | Expired |
| US6132805A | Shutter for thin-film processing equipment | Chemistry; Metallurgy | 83 | Expired |
| US5976261A | Multi-zone gas injection apparatus and method for microelectronics manufacturing equipment | Chemistry; Metallurgy | 69 | Expired |
| US6051113A | Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure using target indexing | Chemistry; Metallurgy | 63 | Expired |
| US6905578B1 | Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure | Chemistry; Metallurgy | 61 | Expired |
| US6190732A | Method and system for dispensing process gas for fabricating a device on a substrate | Emerging Cross-Sectional Technologies | 59 | Expired |
| US6444263B1 | Method of chemical-vapor deposition of a material | Chemistry; Metallurgy | 55 | Expired |
| US5715361A | Rapid thermal processing high-performance multizone illuminator for wafer backside heating | Chemistry; Metallurgy | 53 | Expired |
| US5775416A | Temperature controlled chuck for vacuum processing | Electricity | 47 | Expired |
| US6627995B2 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Electricity | 42 | Expired |
| US6812126B1 | Method for fabricating a semiconductor chip interconnect | Electricity | 38 | Expired |
| US6197166A | Method for inductively-coupled-plasma-enhanced ionized physical-vapor deposition | Electricity | 38 | Expired |
| US6645847B2 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Electricity | 37 | Expired |
| US6048162A | Wafer handler for multi-station tool | Emerging Cross-Sectional Technologies | 37 | Expired |
| US5936829A | Thermally conductive chuck for vacuum processor | Emerging Cross-Sectional Technologies | 35 | Expired |
| US6461675B2 | Method for forming a copper film on a substrate | Electricity | 34 | Expired |
| US6245655A | Method for planarized deposition of a material | Electricity | 32 | Expired |
| US6039848A | Ultra-high vacuum apparatus and method for high productivity physical vapor deposition. | Chemistry; Metallurgy | 31 | Expired |
| US5746897A | High magnetic flux permanent magnet array apparatus and method for high productivity physical vapor deposition | Electricity | 30 | Expired |
| US6204204A | Method and apparatus for depositing tantalum-based thin films with organmetallic precursor | Electricity | 29 | Expired |
| US6508197B1 | Apparatus for dispensing gas for fabricating substrates | Emerging Cross-Sectional Technologies | 28 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.