Polishing apparatus
US5716264A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 1996 |
| Grant date | Feb 10, 1998 |
| Priority date | — |
| Expiry date | Jul 18, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus is employed to polish an object to be polished by urging the surface of the object to be polished against the surface of a polishing cloth and causing a relative movement therebetween, while supplying a polishing liquid into an area between the object to be polished and the polishing cloth. A plurality of nozzles spray respective fluid jets to strike against the surface of the cloth. The plurality of nozzles include more than one type of nozzle which vary flow velocity, flow rate, angle of spray, and cross-sectional configuration of a jet. The plurality of nozzles have axes positioned at a location at different distances from the rotation axis of the polishing cloth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.