Heat treatment apparatus
US5718574A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 27, 1996 |
| Grant date | Feb 17, 1998 |
| Priority date | — |
| Expiry date | Feb 27, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate holding assembly for horizontally holding a substrate to be treated is provided in a heat treatment chamber of a heat treatment apparatus. The substrate holding assembly has an annular base, and a plurality of fixed support projections provided on the annular base, for holding the underside of the substrate to be treated. A flexible beam portion is fixed to the annular base, or to a vertical support rod, and a flexible support projection is provided on the beam portion, for flexibly supporting a portion of the substrate to be treated which tends to flex downward under its own weight. Flexure caused by the own weight of the substrate to be treated held in the substrate holding assembly is thus corrected by the flexible holding portions. Accordingly, stresses caused in the substrates to be treated can be decreased or removed, and occurrence of slips in the substrate to be treated can be precluded in a high-temperature heat treatment. Accordingly, high yields can be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.