Metallization composite having nickel intermediate/interface
US5719070A · kind A · utility
29Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 1996 |
| Grant date | Feb 17, 1998 |
| Priority date | — |
| Expiry date | Oct 2, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metallization composite comprises a refractory metal, nickel, and copper. The refractory metal is preferably titanium (Ti), but other suitable refractory metals such as zirconium and hafnium can also be utilized. An additional optional layer of gold can overlie the copper. The metallization composite is used to connect a solder contact to a semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.