Apparatus for analyzing thin film property
US5723982A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jul 25, 1995 |
| Grant date | Mar 3, 1998 |
| Priority date | — |
| Expiry date | Jul 25, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/854
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for measuring electrical characteristics of a thin surface layer of a sample such as a semiconductor element. A triangular pulse wave of is applied between the sample and a probe needle on a cantilever. By measuring current that flows through the thin surface layer of the sample using the probe needle, I/V characteristics are obtained. A control circuit keep constant the clearance between the probe needle and the thin surface layer of the sample by applying a voltage to a piezoelectric element that supports the sample. I/V characteristics are then measured at a plurality of test points on the thin surface layer of the sample.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.