Clamp ring for domed heated pedestal in wafer processing chamber
US5725718A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1994 |
| Grant date | Mar 10, 1998 |
| Priority date | — |
| Expiry date | Aug 24, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chamber for processing a semiconductor wafer, in which the chamber houses a domed pedestal for supporting the wafer inside the chamber and a clamp ring having a seat formed therein. The seat receives and holds down the periphery of the wafer onto the domed pedestal and includes a wafer engaging surface which engages and holds down the periphery of the wafer. In use the wafer engaging surface defines an angle to the horizontal which is greater than or equal to the angle to the horizontal defined by a tangent to the domed pedestal at the point where the periphery of the wafer is held down onto the pedestal. Typically the angle to the horizontal defined by the seat is about 3.degree. greater than the angle of the tangent to the domed pedestal at the point where the wafer is held down onto the pedestal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.