Patent · US Expired

Method for making thin film transistors

US5728604A · kind A · utility

21Cited by
5References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 13, 1996
Grant dateMar 17, 1998
Priority date
Expiry dateSep 13, 2016

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S438/964

Abstract

A method for making semiconductor thin film transistors (TFTs) having a bottom gate such that the gate electrode is formed in a furrow of an insulating layer, with a gate oxide and body polysilicon formed thereon, thereby allowing the source and drain level to be in a smooth plane parallel with the gate level. Steps that may be included in the disclosed method for fabricating thin film transistors having a bottom gate are: a) forming an insulating layer on a substrate, and forming a furrow by etching the insulating layer at a portion corresponding to where a gate line is to be formed; b) forming a gate line in the furrow by depositing a conductive layer, and etching back the conductive layer; c) forming a gate insulator on the gate line, forming a semiconductor layer on the gate insulator; and d) forming impurity regions at opposite sides of the gate line.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.