Ball grid array semiconductor package with improved heat dissipation and dehumidification effect
US5729432A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jan 18, 1996 |
| Grant date | Mar 17, 1998 |
| Priority date | — |
| Expiry date | Jan 18, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A BGA (ball grid array) semiconductor package with improved heat dissipation and dehumidification effect is disclosed. The above BGA package is provided with an open through slot on the chip mounting portion of the printed circuit board and/or the heat sink. The above through slot is occluded by neither the heat conductive epoxy resin nor the solder mask but is simply opened, thus directly exposing the bottom surface of the semiconductor chip to the outside of the package and effectively performing heat dissipation and dehumidification without causing any pop corn phenomenon during the dehumidification reflow. The size of the open through slot is not larger than the semiconductor chip. The open through slot is selected from among a rectangular slot, a large circular slot, a plurality of small circular slots, a radial slot, a cross slot or any combination thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.