Apparatus and method for transferring heat from a hot electrostatic chuck to an underlying cold body
US5730803A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1996 |
| Grant date | Mar 24, 1998 |
| Priority date | — |
| Expiry date | Feb 23, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6833
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention discloses an apparatus and method for transferring heat from a hot electrostatic chuck to an underlying cold plate. Further, the overall structure of the electrostatic chuck in combination with the heat transfer apparatus of the present invention permits the thermal and pressure isolation of the high-temperature, vacuum process chamber containing the work piece processing surface of the electrostatic chuck from the low-temperature, atmospheric pressured heat transfer apparatus of the present invention. In a preferred embodiment of the heat transfer apparatus, the apparatus comprises: an electrostatic chuck body having a buried electrode for high voltage DC and RF electrical input and a buried heating element, whereby the electrostatic chuck can be heated; a controlled heat transfer apparatus, including a heat transfer plate having a first surface in thermal contact with the electrostatic chuck body and a second surface in contact with at least one heat transfer thermal well; a cold body in thermal contact with the at least one heat transfer thermal well; and a thermal grease between the thermal well and the cold body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.