Robert Steger
48Patents
25h-index
51Co-inventors
88Inventor score
Filing activity: Mar 19, 1990 → Jan 12, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6847014B1 | Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support | Electricity | 637 | Expired |
| US6170428A | Symmetric tunable inductively coupled HDP-CVD reactor | Electricity | 322 | Expired |
| US5788799A | Apparatus and method for cleaning of semiconductor process chamber surfaces | Emerging Cross-Sectional Technologies | 184 | Expired |
| US7274004B2 | Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support | Electricity | 155 | Expired |
| US6108189A | Electrostatic chuck having improved gas conduits | Emerging Cross-Sectional Technologies | 138 | Expired |
| US6444083B1 | Corrosion resistant component of semiconductor processing equipment and method of manufacturing thereof | Chemistry; Metallurgy | 103 | Expired |
| US6805952B2 | Low contamination plasma chamber components and methods for making the same | Emerging Cross-Sectional Technologies | 96 | Expired |
| US5522131A | Electrostatic chuck having a grooved surface | Emerging Cross-Sectional Technologies | 87 | Expired |
| US5720818A | Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck | Emerging Cross-Sectional Technologies | 81 | Expired |
| US6770852B1 | Critical dimension variation compensation across a wafer by means of local wafer temperature control | Electricity | 74 | Expired |
| US5292399A | Plasma etching apparatus with conductive means for inhibiting arcing | Emerging Cross-Sectional Technologies | 65 | Expired |
| US5085727A | Plasma etch apparatus with conductive coating on inner metal surfaces of chamber to provide protection from chemical corrosion | Emerging Cross-Sectional Technologies | 62 | Expired |
| US5730803A | Apparatus and method for transferring heat from a hot electrostatic chuck to an underlying cold body | Electricity | 55 | Expired |
| US5100502A | Semiconductor wafer transfer in processing systems | Emerging Cross-Sectional Technologies | 53 | Expired |
| US6896765B2 | Method and apparatus for the compensation of edge ring wear in a plasma processing chamber | Electricity | 51 | Expired |
| US6721162B2 | Electrostatic chuck having composite dielectric layer and method of manufacture | Emerging Cross-Sectional Technologies | 51 | Expired |
| US5308417A | Uniformity for magnetically enhanced plasma chambers | Electricity | 40 | Expired |
| US7161121B1 | Electrostatic chuck having radial temperature control capability | Electricity | 35 | Expired |
| US5494523A | Controlling plasma particulates by contouring the plasma sheath using materials of differing RF impedances | Electricity | 34 | Expired |
| US5356486A | Combined wafer support and temperature monitoring device | Electricity | 31 | Expired |
| US5534108A | Method and apparatus for altering magnetic coil current to produce etch uniformity in a magnetic field-enhanced plasma reactor | Electricity | 30 | Expired |
| US6414834B1 | Dielectric covered electrostatic chuck | Emerging Cross-Sectional Technologies | 29 | Expired |
| US7718932B2 | Electrostatic chuck having radial temperature control capability | Electricity | 26 | Active |
| US7176403B2 | Method and apparatus for the compensation of edge ring wear in a plasma processing chamber | Electricity | 25 | Expired |
| US5904776A | Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck | Emerging Cross-Sectional Technologies | 25 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.