Polishing pad and method of use
US5733176A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 1996 |
| Grant date | Mar 31, 1998 |
| Priority date | — |
| Expiry date | May 24, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/921
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A novel polishing pad having voids and optional abrasives incorporated therein is disclosed. The contents of each void facilitates the detection of the end point at which the polishing pad becomes worn out during a polishing operation. Chemicals stored within voids are released by the breaching of the voids caused by the polishing operation. The chemical released is selected to halt the chemical polishing, change the color of the pad, or to detectably change the torque load on the rotating fixed abrasive pad. Empty voids cause an noise from fluids such as air being forced into the voids. The visual or audible diagnostic resulting from the breaching of voids help to control the polishing operation and thus increase yield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.