Method for enhancing the solderability of a surface
US5733599A · kind A · utility
33Cited by
14References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 1996 |
| Grant date | Mar 31, 1998 |
| Priority date | — |
| Expiry date | Mar 22, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/073
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.