Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap
US5734560A · kind A · utility
30Cited by
19References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1996 |
| Grant date | Mar 31, 1998 |
| Priority date | — |
| Expiry date | Mar 20, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cap for attaching a chip or other device to a multi-layer electronic structure. The cap includes a plurality of pads of an electrically-conducting material attached over plated through holes of the multi-layer electronic structure. Each of the pads includes a flat upper surface for attaching the chip or other device to the multi-layer structure, provides an electrical connection between the chip or other device and the multi-layer structure, and seals the through holes to prevent solder from entering the plated through hole. The pads are physically isolated from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.