Process for manufacturing a semiconductor device having a stepped encapsulated package
US5736428A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jan 27, 1997 |
| Grant date | Apr 7, 1998 |
| Priority date | — |
| Expiry date | Jan 27, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.