Method of forming conductive bumps on die for flip chip applications
US5736456A · kind A · utility
250Cited by
16References
41Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 17, 1996 |
| Grant date | Apr 7, 1998 |
| Priority date | — |
| Expiry date | Jul 17, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/959
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an improved method for forming a UBM pads and solder bump connections for flip chip which eliminates at least one mask step required in standard UBM pad forming processes. The method also includes repatterning bond pad locations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.